Tag Archives: TSV

Should I say "field 8" or "column 8" in this case?

By hanson44

I saw some recent posts where I thought the terms “field” and “column” were being misused. I work with data a lot, and have my opinions. I’m wondering if those opinions are correct.

***** Rows seem clear – I don’t think there is any controversy about what a row is, either for database or text file.

***** Flat file columns seem clear – For a flat file such as the following, I don’t think there is any controversy about what a column is. Column in file shown is like “cut -c 1”. Several columns may combine to make a field, so “cut -c 1-11” cuts the field in columns 1-11 (record ID here), such as 09011101001, 09011101002, etc.

Code:

09011101001270101192008BNB1102008000027060126720001305591
09011101002230101212008B5P1102008000053110126720001305591
090111010032501011120084XB1102008000085030126720001305591
09011101005250101232008GUW1202008000145050126720001305591
09011101006070101132008E3S1102008000157050126720001305591
09012101007060102062008GWB1102008000186030361080005352411
090111010081601011920082XW1102008000226050126720001305591


****** CSV and TSV “columns” seem misused to me – Here is similar data, in TSV format. I would call say “data in field 8” instead of “data in column 8”. I think I’m supported by the cut command and it’s use of “cut -f 8 -d,” (–fields) for parsing this kind of data. To me, “column 8” means “cut -c 8”. By the time we get out to “field 8”, it doesn’t line up vertically anymore, so I doesn’t even look like a column. But it seems many, or perhaps most, say “data in column 8”. But many of those can barely string together a sentence. 😡 So I thought I would ask the experts. Is it more correct to say “column 8” or “field 8” for what “cut -f 8 -d,” retrieves in example below? :rolleyes:

Code:

9,1,1,1,1001,27,1,01192008,01,19,2008,BNB,110,2008000027
9,1,1,1,1002,23,1,01212008,01,21,2008,B5P,110,2008000053
9,1,1,1,1003,25,1,01112008,01,11,2008,4XB,110,2008000085
9,1,1,1,1005,25,1,01232008,01,23,2008,GUW,120,2008000145
9,1,1,1,1006,7,1,01132008,01,13,2008,E3S,110,2008000157,2
9,1,2,1,1007,6,1,02062008,02,06,2008,GWB,110,2008000186,2
9,1,1,1,1008,16,1,01192008,01,19,2008,2XW,110,2008000226


…read more
Source: FULL ARTICLE at The UNIX and Linux Forums

Researchers utilize atomic layer etch analysis to accelerate development of green chemistries

Researchers sponsored by Semiconductor Research Corporation (SRC) today announced development of a modeling process designed to simulate atomic-level etching with chemicals that are effective alternatives to widely used perfluorocarbon (PFC) gases. The novel approach under way at the University of California, Los Angeles (UCLA) will identify and evaluate green plasma chemistries for processing emerging memory/logic devices and through-silicon-via (TSV)-enabled technologies for the semiconductor industry. …read more
Source: FULL ARTICLE at Phys.org

PVA Tepla, imec demonstrate 3D through-silicon via (TSV) void detection using GHz scanning acoustic microscopy

Imec and PVA Tepla present breakthrough results in the detection of TSV voids in 3D stacked IC technology. After having applied Scanning Acoustic Microscopy to temporary wafer (de)bonding inspection, they successfully used new advanced GHz SAM technology to detect TSV voids at wafer-level after TSV Copper plating. Together, they will continue to investigate the applicability of high-frequency scanning acoustic microscopy for non-destructive submicron void detection.
Source: FULL ARTICLE at Phys.org