Tag Archives: PCB

Error Code ER 1F in LG Refridgerator

By frankk

Hello! I have an LG fridge # LFX25960ST. Last year after a power outage we regained power and a code ER 1F came up on my fridge. I called LG and of course it is out of warranty. I have determined after a bit of looking around, that this code refers to the ICE BLOWER FAN (part # 5209JA1044A). The error could also be in the Main board or the PCB board. I think it is the fan that is the problem, but I would like to make sure before I go buy one. I believe I can verify voltage on the main board…. however… I don’t know how to access the main board. Also I think I could check the operation of the fan itself.

LG support said to turn off the fridge via circuit breaker for 8 hours and restart. I did this, the ice maker came back on, worked for a week or so, and got the message again (shut off, ice leaked on laminate floor šŸ™ ). I had it off for a while and I turned it on again this morning. As of 10pm it is still on and making ice. I thought that due to the power outage maybe the board was fried. But… the rest of the fridge works fine and the ice maker is working ok now.

COuld it be the fan connection? Or frost/fan freezing up? Any ideas how to verify the fan is bad and should be replaced? I know I can just replace the fan….. but I would like some more verification that this would be the way to go. Thanks!

Frank

From: http://www.doityourself.com/forum/electric-large-kitchen-home-appliances/493288-error-code-er-1f-lg-refridgerator.html

Teradyne to Debut New TestStation Systems at SMT Hybrid Packaging 2013 Conference

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Teradyne to Debut New TestStation Systems at SMT Hybrid Packaging 2013 Conference

NORTH READING, Mass.–(BUSINESS WIRE)– Teradyne, Inc. (NYS: TER) , a global provider of proven, high quality, PCB test and inspection equipment, announced that the company will participate in the SMT Hybrid Packaging 2013 Conference as both an exhibitor and presenter, and will debut several major test system upgrades at the event that bring improved efficiency and productivity gains to high-volume PCB production.

SMT Hybrid PackagingĀ is EuropeĀ“s largest event on System Integration in Micro Electronics. The event will take place in Nuremberg, Germany from April 16-18. Teradyne will exhibit in Booth #7-431. Teradyne Marketing manager John Arena will present to conference attendees in a session titled, “Doing More with a Lot Less: Automation and Multi-site PCB Test Economics.” The presentation will take place on Tuesday, April 16 from 15:40-16:00 local time.

Teradyne has been a leading provider of high quality Printed Circuit Board (PCB) automated production test equipment for over 40 years. Teradyne’s Commercial Board Test Group designs, manufactures and markets Automatic Test Equipment (ATE) solutions to the world’s leading PCB original equipment manufacturers (OEM) and electronics manufacturing services (EMS) suppliers. Its mission is to help electronics manufacturers ensure product integrity and final quality of their products by delivering the highest possible fault coverage and defect detection technology available.

TestStationĀ is Teradyne’s flagship family of in-circuit test systems that provide electronics manufacturers with reliable, high-quality test for all the latest PCB technologies. At SMT Hybrid Packaging, Teradyne will debut new members of the TestStation family that bring improved efficiency and productivity gains to high-volume PCB production lines.

“SMT Hybrid Packaging is the perfect venue to launch the next generation of Teradyne’s TestStation,” said Arena. “It draws a global audience of electronics manufacturers who are all there to gain exposure to the very latest technology. We’re looking forward to the conference.”

About Teradyne

Teradyne (NYS: TER) is a leading supplier of Automatic Test Equipment used to test semiconductors, wireless products, data storage and complex electronic systems which serve consumer, communications, industrial and government customers. In 2012, Teradyne had sales of $1.66 billion and employs approximately 3,600 people …read more

Source: FULL ARTICLE at DailyFinance

EPA Issues Record of Decision on Grasse River Remediation

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EPA Issues Record of Decision on Grasse River Remediation

Alcoa will move forward with next phase of Massena Modernization Project

NEW YORK–(BUSINESS WIRE)– Alcoa (NYS: AA) today confirmed that the U.S. Environmental Protection Agency (USEPA) has issued a Record of Decision (ROD) on the remediation of the Grasse River that is consistent with the Proposed Remedial Action Plan issued in October, 2012.

Alcoa, USEPA, the NY Department of Environmental Conservation (DEC) and other parties have been evaluating remedial alternatives to address elevated levels of polychlorinated biphenyls (PCBs) in fish in the lower Grasse River for more than 15 years. The ROD requires dredging and capping of contaminated sediments in a 7.2 mile stretch of river. The estimated cost of the remediation is $243 million, which Alcoa has fully accrued.

“Alcoa has worked cooperatively with the EPA to address the PCB sediments in the Grasse River, and we are pleased to see this final step in the remediation decision process completed,” said Kevin Anton, Alcoa Vice President and Chief Sustainability Officer. “Based on 15 years of scientific research, Alcoa believes the remedy is both protective of human health and the environment and effective over the long term. We look forward to working with the EPA, the New York State DEC and the other stakeholders during the design and implementation phases of the project.”

Alcoa can now move forward with the next phase of the Massena Modernization Project. The next phase includes spending $52 million for work that will begin in June 2013, including $10 million toward economic development in the North Country.

Alcoa would like to thank the many government officials, employees, union leaders and community members for their support in getting us to this important stage in Massena’s future.

Forward-Looking Statements

This release contains statements that relate to future events and expectations and as such constitute forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Forward-looking statements include those containing such words as “expects,” “move forward,” “will,” or other words of similar meaning. All statements that reflect Alcoa’s expectations, assumptions or projections about the future other than statements of historical fact are forward-looking statements. Forward-looking statements are subject to a number of known and unknown risks, uncertainties, and other factors and …read more

Source: FULL ARTICLE at DailyFinance

Pulse Electronics Introduces Press-fit RJ45 Connectors with Integrated Magnetics

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Pulse Electronics Introduces Press-fit RJ45 Connectors with Integrated Magnetics


Eliminates wave soldering for a more efficient and cost-effective assembly process

SAN DIEGO–(BUSINESS WIRE)– Pulse Electronics Corporation (NYS: PULS) , a leading provider of electronic components, introduces press-fit RJ45 integrated connector modules (ICMs) with magnetics. Using a press-fit pin (also called compliant or interference pin) provides a pressure contact with the printed circuit board (PCB), eliminating the need for wave soldering. The JPB 2×6 1000BASE-T PoE ICM and JT5 2xN 10GBASE-T ICM families are available as press-fit ICMs. Eliminating the wave soldering process saves time, increasing throughput and reducing costs, and allows for rework of the ICM without damaging the customer’s PCB.

“A typical production process consists of a component placement process and then soldering the components to the PCB. When you have both surface mount and through-hole components you have to process the PCB through both a reflow solder process for the SMT components and a wave soldering process for the through-hole components. The ICM is often the only through-hole component on the PCB, so wave soldering is necessary specifically for that part,” explained Jonas Miller, product line manager, Pulse Electronics. “Pulse Electronics designed these press-fit pin ICMs in response to market demand to remove wave soldering from the PCB manufacturing process. In addition, having press-fit technology enables the manufacturer to rework the ICM more easily, without damaging the PCB.”

Pulse Electronics‘ press-fit RJ45 ICMs meet IEEE 802.3 specifications. Detailed process specifications are available to assist customers with the insertion and extraction of these press-fit pin ICMs. The ICMs are packaged in trays. Prices start at approximately $5.00/port. High volume discounts are available. Lead time is 8 to 10 weeks. Information and datasheets on Pulse Electronics‘ 2×6 press-fit ICMs are at http://productfinder.pulseeng.com/product/JPB-0010NL or for more information visit, http://www.pulseelectronics.com/Press-fitRJ45.

Photo available at http://www.pulseelectronics.com/image.php?blob_id=3808

About Pulse Electronics:

Pulse Electronics is the electronic components partner that helps customers build the next great product by providing the needed technical solutions. Pulse Electronics has a long operating history of innovation in magnetics, antennas, and connectors, as well as the ability to ramp quickly into high-quality, high-volume production. The …read more
Source: FULL ARTICLE at DailyFinance

IXYS Introduces the Smallest Footprint Surface Mount Package for 1.2KV to 1.8KV Power Semiconductors

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IXYS Introduces the Smallest Footprint Surface Mount Package for 1.2KV to 1.8KV Power Semiconductors

BIEL, Switzerland–(BUSINESS WIRE)– IXYS Corporation (NAS: IXYS) , a leader in power semiconductors and IC technologies for energy efficient products used in power conversion and motor control applications, announced today the D2-Pak (TO-263) and D3-Pak (TO-268) packages with higher ‘creepage’ spacing which enables higher voltage power semiconductors to be used in these Surface Mount Devices (SMD).

“The market demands smaller footprint solutions for 1.2KV to 1.8KV power semiconductors. The main reason for this is the higher power demands which are realized by higher voltages instead of higher current. By using a higher voltage the conduction losses in copper wires are less for power control circuits; therefore, thinner copper conductors or traces on PCB circuits can be used. These SMDs improve energy efficiency, reduce cost, reduce size and reduce weight when used in power electronics,” commented Mr. Jeroen van Zeeland, head of marketing at IXYS Germany.

SMDs are preferred for lower cost alternatives to modules and to other bulkier discrete components in integrated power designs. Until now there was no such solution for applications higher than 1.2KV. The new IXYS D2-Pak and D3-Pak designs now offer the standard footprint, but with compliance to the high voltage ‘creepage’ specifications.

For D3-Pak the creepage distance between the terminal to the copper of the backside is greater than or equal to 5.80 mm. The same value for the D2-Pak is greater than or equal to 4.70 mm. This enables the use of 1.2KV D3-Pak in pollution degree 2 industrial designs. In addition to industrial power control applications, these devices target other 1.2KV to 1.8KV power supply, UPS, renewable energy, motor drives and medical applications.

The following products are already available:

  • CMA30E1600PZ (D2-PakHV, single SCR with 30A and 1600V)
  • DMA10P1600PZ (D2-PakHV; phase-leg for diode bridges with 10A and 1600V)
  • CMA50E1600TZ (D3-PakHV, single SCR with 50A and 1600V)
  • DSP45-16TZ (D3-PakHV; phase-leg for diode bridges with 45A and 1600V)
  • Standard delivery mode for D2-Pak is Tape & Reel and tube for D3-Pak (T&R on request)

More product information is available on the IXYS website, for example, http://ixapps.ixys.com/DataSheet/CMA30E1600PZ.pdfor by contacting your nearest IXYS sales office.

…read more
Source: FULL ARTICLE at DailyFinance

Programmable Hall Switch from Diodes Incorporated Extends Flexibility of Detection Circuit Designs

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Programmable Hall Switch from Diodes Incorporated Extends Flexibility of Detection Circuit Designs

PLANO, Texas–(BUSINESS WIRE)– Diodes Incorporated (NAS: DIOD) , a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic and analog semiconductor markets, today introduced a programmable omnipolar Hall effect switch enabling designers to use the same contactless detection circuit in multiple applications or with different field strengths. The miniature and micropower AH1898 is suitable for numerous portable consumer applications including cell phones, tablets and cameras as well as a variety of domestic, office and industrial equipment.

Able to detect both north and south magnetic fields, the AH1898 features a band-select pin, which allows device sensitivity to be changed to one of two predefined magnetic sensitivity ranges. In addition, it can also be used change the band on the fly, using an external logic source or microcontroller. The high sensitivity of the Hall sensor also means that it can support weaker, lower cost magnets and can be used at a greater distance from the magnet.

The AH1898 Hall switch has been optimized for use over a 1.6V to 3.6V low-voltage supply range and employs a hibernating clocking system to minimize power consumption. With an average supply current of just 4.3ĀµA (typical) at 1.8V, this micropower device helps to extend portable battery cell lifetime.

To ensure high reliability in a broad range of applications, the AH1898 has been designed with an 8kV ESD rating on supply and output pins. Circuit robustness is further raised by the AH1898’s chopper stabilized design, delivering superior temperature stability over the operating range from -40ĀŗC to +85ĀŗC, absolute minimum switch point drift, and enhanced immunity to RF noise and physical stress.

The AH1898 is available in the miniature 0.8mm x 0.8mm CSP package, making it 12 times smaller than common TSOT-packaged alternatives. At the same time, its simple 4-pin footprint and integration of pull-up resistors results in reduced external component counts and a simplification of PCB layouts. For further information, visit the Company’s website at www.diodes.com.

About Diodes Incorporated

Diodes Incorporated (NAS: DIOD) , a Standard and Poor’s SmallCap 600 and Russell 3000 Index company, is a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic and analog semiconductor markets. Diodes serves the consumer electronics, computing, communications, industrial, and automotive markets. …read more
Source: FULL ARTICLE at DailyFinance

Pulse Electronics' EP13 Plus DC/DC Transformer Platform Provides >25% More Power Handling Capability

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Pulse Electronics’ EP13 Plus DC/DC Transformer Platform Provides >25% More Power Handling Capability


Catalog Series of Transformer Topologies in Industry Standard Package

SAN DIEGO–(BUSINESS WIRE)– Pulse Electronics Corporation (NYS: PULS) , a leading provider of electronic components, announces its new EP13 Plus platform that delivers 25% more power handling capability than the industry standard EP13 platform in the same PCB footprint. This catalog series of 12 isolation transformers is designed for multiple input voltage ranges (9-57v and 33-57v) and can provide six different output voltage combinations from 3.3v to 24v. The transformers are used in DC/DC power supplies for Power over Ethernet (PoE, PoE+), datacom, telecom, and industrial applications.

Pulse’s EP13 Plus platform incorporates two innovative features that advance the wire-wound transformer technology. The first innovation is the use of a modified core with an increased cross-sectional area to reduce the number of turns necessary for a given output voltage, or to increase the output power by better utilization of the available winding window. The second innovation is a new bobbin lead shape which allows for an increased number of lead wire terminations. This helps avoid damaging the leads or causing solder bridges to adjacent leads during IR reflow. Optimization of the magnetic core combined with the modified lead design of the winding termination give the EP13 Plus 25% more power throughput and lower winding resistance.

Pulse Electronics‘ EP13 Plus series transformers are designed for either active clamp forward (PA3856.XXXNL) or continuous mode flyback (PA3855.XXXNL) topologies and offer 24 different output voltage and power combinations. The transformers come in an industry standard package of 14.0(h)x17.7(l) mm. The EP13 Plus series is used in a wide variety of electronic applications including wireless base stations, IP phones, security cameras, automation and test equipment, and networking gear.

“The innovative design approach for the new Pulse EP13 Plus platform offers designers the flexibility to create a more efficient design (less power loss) at the same power as the industry platform, or the ability to increase system power density or lower thermal loads in existing designs. In a market where power density and system efficiency are crucial, this is a significant improvement,” said John Gallagher, staff field applications engineer, Pulse Electronics.

Pulse Electronics‘ PA3856.XXXNL and PA3855.XXXNL DC/DC isolation transformers …read more
Source: FULL ARTICLE at DailyFinance

Orbotech Wins $18M in Frame Agreements from Two Leading PCB Makers

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Orbotech Wins $18M in Frame Agreements from Two Leading PCB Makers

PCB Equipment for Mass Production of High-End Electronic Devices

YAVNE, Israel–(BUSINESS WIRE)– Orbotech Ltd. (NASDAQ/GSM: ORBK) today announced that it has signed major frame agreements, totaling approximately $18 million in value, with two leading printed circuit board (“PCB“) makers in Taiwan and China for the mass production of high density interconnect PCBs.

These orders, which are expected to include multiple Paragonā„¢ laser direct imaging (“LDI“) and automated optical inspection systems, as well as related digital production tools, reflect an increasing level of capital investment by PCB customers in the most up-to-date Orbotech technology used in the manufacture of advanced PCBs for highly sophisticated electronic devices.

“We are gratified that these customers, which are major suppliers to several of the world’s top electronics companies, have once again selected Orbotech solutions as part of their strategic growth plan,” commented Mr. Richard Klapholz, Corporate Executive Vice President of Electronics Business at Orbotech Ltd. Mr. Klapholz added: “PCB manufacturers are coming to realize that the significant challenges involved in the mass production of high quality, ultra-thin and increasingly complex boards can now only be met by the use of systems having LDI capabilities. The highly competitive nature of the advanced micro manufacturing segment requires continuous development of new production techniques that can keep pace with the rapid advances in electronics innovation and we are very pleased to be partnering with our customers in this process.”


About Orbotech Ltd.

Orbotech Ltd. (NASDAQ/GSM: ORBK) has been at the cutting edge of the electronics industry supply chain, as an innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products, for over 30 years. The Company is a leading provider of yield-enhancing and production solutions, primarily for manufacturers of printed circuit boards, flat panel displays and other electronic components; and today, virtually every electronic device is produced using Orbotech technology. The Company also applies its core expertise and resources in other advanced technology areas, including character recognition for check and forms processing and solar photovoltaic manufacturing. Headquartered in Israel and operating from multiple locations internationally, …read more
Source: FULL ARTICLE at DailyFinance

IR's High Current IR3847 Gen3 SupIRBuckĀ® Delivers Superior Performance, Dramatically Reduces PCB Siz

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IR’s High Current IR3847 Gen3 SupIRBuck Ā® Delivers Superior Performance, Dramatically Reduces PCB Size by 70% and Simplifies Design

Best-in-class voltage regulator for high performance communications and computing applications

EL SEGUNDO, Calif.–(BUSINESS WIRE)– International Rectifier, IRĀ® (NYS: IRF) , a world leader in power management technology, today announced the introduction of the IR3847 high current Point-of-Load (POL) integrated voltage regulator that extends the current rating of IR‘s third generation SupIRBuckĀ® family up to 25A in a compact 5×6 mm package.

As a result of a new thermally enhanced package using copper clip and several proprietary innovations in the controller, the IR3847 can operate at 25A without heatsink, and reduces PCB size by 20% compared to alternative integrated solutions and 70% compared to discrete solutions using a controller and power MOSFETs. A complete 25A power supply solution can be implemented in as little as 168mm2.

The new device integrates IR‘s latest generation power MOSFETs with a feature-rich, third generation SupIRBuckĀ® controller that includes post-package precision dead-time trimming to optimize losses, and internal smart LDO to optimize efficiency across the entire load range. True differential remote sense essential for high current applications, 0.5% reference voltage accuracy in 25Ā°C to 105Ā°C temperature range, input feed-forward and ultra-low jitter combine to enable total output voltage accuracy less than 3% over line, load, and temperature, as required by high performance communications and computing systems.

As part of the new Gen3 SupIRBuck single input voltage (5V-21V) family, the IR3847 features a proprietary modulator scheme that reduces jitter by 90% compared to standard solutions. This has the dual benefit of reducing output voltage ripple by approximately 30% and allowing higher frequency/higher bandwidth operation for smaller size, better transient response and fewer output capacitors.

Available in a compact 5x6mm PQFN package, the IR3847 also offers market-leading electrical and thermal performance for 15A – 25A applications such as peak efficiency greater than 96% and temperature rise at 25A as low as 50Ā°C. Other advanced features include external synchronization, sequencing, VTT tracking, and output voltage margining.

The pinout is optimized for easy placement of bypass capacitors and the internal thermally compensated current limit offers three settings that allow programmability without extra components and layout complications.

“With the new high current IR3847 with true differential remote sense, IR addresses the challenges of thermally- and space-constrained high density, high current applications by enabling a fully integrated solution up to …read more
Source: FULL ARTICLE at DailyFinance

Kulicke & Soffa Launches New LED Package Singulation Blades – OptoTMceramic & OptoTMPCB

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Kulicke & Soffa Launches New LED Package Singulation Blades – Opto TM ceramic & Opto TM PCB

SINGAPORE–(BUSINESS WIRE)– Kulicke & Soffa Industries, Inc. (NAS: KLIC) (“K&S”) today announced the launch of its new OptoTMceramicand OptoTMPCBPackage Singulation Blades for the LED market.

Opto TM Hub and Hubless Blades significantly improve LED package singulation quality, precision and productivity, by providing improved stability and longer blade life. Highlighted features of the new OptoTM blades include: attractive cost of ownership through consistently longer blade life, 100% pre-dressed to shorten on-site dressing steps, and an optional kerf control feature to meet special application requirements. Significant UPH improvement has been observed in some applications by enabling higher feed speeds.

The new OptoTMceramic blade utilizes unique electroplating technology to achieve up to 3 times the blade life of traditional resin/metal bonded blades, with minimal kerf change and blade wear. The new design minimizes machine downtime for blade changes, achieves the highest cut quality, and allows higher feed speeds, increasing productivity.

The new OptoTMPCB blade for PCB & composite material substrates has an optimized design which provides uniform vertical wear, maintaining cutting power and consistent sawn package dimensions, thus eliminating in-process dressing steps. The optional ‘slits’ feature improves blade cooling, achieving high singulation quality without typical whisker issues.

Nelson Wong, Vice President – Wire Bonding Solutions Business Unit, said: “The OptoTM blades provide a significant CoO improvement and a ‘plug and play’ solution for most dicer spindle configurations. Moreover, the hub-type design provides flexibility to various dicer configurations for package singulation and enhances machine utilization and factory productivity.”

The OptoTMceramic& OptoTMPCB will debut at the Semicon China show at the Shanghai New International Expo Centre from March 19-21, 2013.

About Kulicke & Soffa

Kulicke & Soffa (NAS: KLIC) is a global leader in the design and manufacture of semiconductor and LED assembly equipment. As a pioneer in this industry, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions, adding wedge bonding and a broader range of expendable tools to its core ball bonding products. Combined with its extensive expertise in process technology, K&S is well positioned to help customers meet the challenges of assembling the next-generation semiconductor …read more
Source: FULL ARTICLE at DailyFinance

Mentor Graphics Introduces Unique FloTHERM XT Technology for Electronics Cooling Simulation – from C

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Mentor Graphics Introduces Unique FloTHERM XT Technology for Electronics Cooling Simulation – from Concept to Verification

WILSONVILLE, Ore.–(BUSINESS WIRE)– Mentor Graphics Corporation (NAS: MENT) today announced the FloTHERMĀ® XT software that enables the industry’s first integrated MDAEDA electronics cooling simulation solutionā€”from conceptual through detailed designā€”to dramatically shorten the process. This solution addresses two of today’s trends which are electronic challenges and geometric complexity. The electronic challenges are driven by increasing speed, density, and power consumption of ICs, PCBs and electronic systems. The increasing geometric complexity is driven by decreasing size and the increased influence of industrial design which requires handling of complex shapes. The FloTHERM XT technology efficiently interconnects mechanical design automation (MDA) and electronic design automation (EDA) domains and addresses the needs of design engineers as well as thermal specialists.

This electronics cooling simulation solution enables earlier virtual prototyping, fewer design iterations, and advanced “what-if” analysis for improved product quality and faster time-to-market benefits. Key markets where the FloTHERM XT product can benefit design teams from components to systems of electronic applications are industries such as automotive, aerospace, telecommunications, computing, industrial automation and consumer electronics.

“In support of our design consultancy business, FloTHERM XT empowers us to perform thermal analysis throughout our client’s design process. We are now able to start optimizing designs from the early concept stage and, using the same data model, can continue to support our clients with increasing levels of sophistication and shape complexity as they progress onto the verification/prototype phase and prepare a fully vetted design ready for manufacturing,” said Guy Wagner, director, Electronic Cooling Solutions.

Combining the electronics cooling DNA from the Mentor GraphicsĀ® Corporation’s market-leading FloTHERMĀ® thermal analysis software, and Concurrent Computational Fluid Dynamic (Concurrent CFD) technology from the FloEFDā„¢ product, the FloTHERM XT solution offers the power and performance to solve complex electronics systems design problems. The product’s easy-to-use interface is fully configurable so new users can customize the functionality features on the screen, providing a scalable user experience that can be adapted as the needs of the design project change.

Imported or CAD-generated geometries work seamlessly with the FloTHERM XT’s SmartPart library of models, and automatic meshing and data convergence provide significant reduction in execution times. It also provides an easy and intuitive direct interface to enterprise platforms such as the market-leading Mentor ExpeditionĀ® Enterprise solution. The direct integration of the FloTHERM XT product with PCB design flows will reduce time-consuming data translation and costly errors. As a result, FloTHERM XT is the only solution on the …read more
Source: FULL ARTICLE at DailyFinance

Semtech Announces Expansion of its Automotive Qualified Product Platform for Power Management and Di

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Semtech Announces Expansion of its Automotive Qualified Product Platform for Power Management and Display Backlighting Applications

SC5012Q and SC220Q broaden Semtech’s AEC-Q100 automotive-qualified power offering

CAMARILLO, Calif.–(BUSINESS WIRE)– Semtech Corporation (NAS: SMTC) , a leading supplier of analog and mixed-signal semiconductors, today launched two new devices in its automotive-qualified products platform. The SC5012Q 4-channel, high-brightness LED driver for infotainment and navigation display backlighting, and the SC220Q 20MHz buck regulator with X-EMITM Inductor Technology.

Both products extend Semtech’s broad automotive-qualified product offering, which includes solutions for power management, RF/ISM, touch interface and transient voltage protection.

“These two AEC-Q100-qualified products offer automotive electronics designers uncompromised performance and rugged dependability,” said Andy Khayat, Senior Business Unit Director for Consumer Power in Semtech’s Power Management Group. “Whether it’s display backlighting or power conversion, Semtech is committed to providing the most advanced power management ICs in fully qualified automotive grade.”

Both the SC5012Q and SC220Q are best-in-class solutions. The SC5012Q drives up to 68 high brightness 150mA LEDs and offers advanced analog/digital dimming of up to 10,000:1 ratio that gives automotive LCD displays an extended range of brightness options for varied driving conditions. The SC220Q provides high-efficiency DC-DC buck conversion while allowing designers to draw their own inductor on a standard PCB board to minimize board height and greatly reduce EMI noise. These benefits enable embedded power supplies in low profile applications like rearview mirrors and backup cameras.


Key Features of SC5012Q

  • Wide VIN range: 4.75V to 45V
  • High VOUT range: up to 65V
  • Up to 68 LEDs (17 LEDs x 4-ch) at 150mA/ch
  • Ultra-wide PWM dimming range up to 10,000:1 at 100Hz
  • Package: 24-pin QFN (4x4x1mm)


Key Features of SC220Q

…read more
Source: FULL ARTICLE at DailyFinance

ESI Revolutionizes Flexible Circuit and Interconnect Processing with its New Model 5335

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ESI Revolutionizes Flexible Circuit and Interconnect Processing with its New Model 5335

PORTLAND, Ore.–(BUSINESS WIRE)– Electro Scientific Industries, Inc. (NAS: ESIO) , a leading supplier of innovative laser-based manufacturing solutions for the microtechnology industry, today announced the release of its Model 5335 UV Laser Drilling System. As successor to the market-leading 5330 product family, the 5335 benefits from over 15 years of market experience and R&D efforts to deliver the industry’s lowest cost of ownership in flexible circuit and general micromachining applications through improved throughput and quality.

The 5335 brings state of the art performance to the flexible circuit and general micromachining industry by use of its proprietary Third Dynamicsā„¢ technology. With this technology, the 5335 provides enhanced optical beam manipulation beyond what is achievable with simple galvanometer control. Third Dynamicsā„¢ enables industry-leading drill, routing, and skiving performance through a combination of ESI‘s patented compound beam positioning and solid-state optical technologies.

“We are very excited about the 5335’s upgraded productivity and convenient operation,” said Jae-Hong Min, president of long-time ESI customer and partner Korea Via Tech. After experiencing the benefits of the Model 5335 over a trial period, this supplier to PCB manufacturing heavyweights such as Samsung and LG Innotek placed a multi-system order. Min explained, “We expect that the 5335’s high productivity and quality will positively impact confidence amongst customers.”

The 5335’s patented solid-state beam steering technologies, advanced motion control algorithms and sophisticated power control processes enable gains in throughput and quality. Martin Orrick, Director of Product Development for ESI‘s Micromachining, Test and Inspection division, stated, “The 5335 represents the seventh generation in ESI‘s single-head UV laser drilling tools. ESI has engineered the system around building blocks field-tested in hundreds of systems worldwide while further enhancing it with capabilities never before seen in the laser material processing industry. As a market leader in UV laser tools with over 1,000 such systems sold, we are convinced that this is the most flexible and productive UV laser tool available today.”

The 5335 is currently available for sale and is priced to deliver the industry’s lowest cost of ownership.

About ESI, Inc.

ESI is a leading supplier of innovative, laser-based manufacturing solutions for the microtechnology industry. Our systems enable precise structuring and testing of micron to submicron features in electronic devices, semiconductors, LEDs and other high-value components. We partner with our customers to make breakthrough technologies possible in …read more
Source: FULL ARTICLE at DailyFinance

Hon Hai to Keep Some Apple Production Lines Running During Chinese New Year

By Chuck Jones, ContributorImage via CrunchBase Another indication that demand for Appleā€™s iPhone 5 and iPad Mini is strong comes from a report by BrightWire translating a Taiwanese United Daily News article that Hon Hai (also known as Foxconn) and at least one other company, PCB supplier Flexium Interconnect, will not shut down during […]
Source: Forbes Latest